| Engineering Capacity ： |
|
DYNAMIC FLEXING REQUIREMENTS
REDUCE SPACE，FOLDED IN 3D SPACE
LIGHT WEIGHT
STABILITY IN HIGH SPEED ELECTRIC CURRENT CIRCULATION
FLEXING FOR EASIER INSTALLATION
GOOD INSULATION
GOOD ANTI-INTERFERENCE |
 |
Description |
PARAMETERS |
POLYIMIDE |
POLYESTER |
| BASE THICKNESS（μm） |
12.5, 25, 35, 50 |
12.5, 25, 35, 50 |
| COPPER THICKNESS （μm） |
12, 17.5, 35, 50, 70, 105 |
| MIN LINE WIDTH/LINE SPACE(mm) |
0.05/0.05 |
| MIN HOLE SIZE（MM） |
0.2 |
| TOLERANCE（MM） |
（OUTLINE）±0.1/(COVERLAYER)±0.2 |
| PEEL STRENGTH（KGF/CM） |
1.0以上ABOVE 1.0 |
0.8以上ABOVE 0.8 |
| SOLDER RESISTANCE |
288℃ 10（SCECONDS） |
204℃ 5（SCECONDS） |
Surface treatment |
THICKNESS |
 |
| HOT AIR LEVELING（H.A.L.） |
5-35μm |
| ENTEK/O.S.P |
|
| TIN/LEAD PLATING |
2-20μm |
| NI/AU PLATING |
NI:1-5μm AU:0.07-0.2μm |
| IMMERSION GOLD |
NI:1-5μm AU:0.07-0.2μm |
| IMMERSION TIN |
TIN:0.8-2μm |
| TIN PLATING |
2-20μm |
| Main Product
|
Manufacturing cycle
|
Monthly manfacturing capacity
|
Rate/Percentage |
| Sigle-sided board
|
2-4 days |
4000square meter |
20% |
| Double-sided board |
3-5 days |
8000square meter |
30% |
| Carved board |
2-4 days |
3000square meter |
15% |
| Multilayer board |
4-6 days |
5000square meter |
25% |
| Rigid flex board
|
7-12 days |
3000square meter |
10% |
|
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|
