Flexible Printed Circuit (FPC)
Flexible Printed circuits consist of patterned conductive layers made of copper foil and dielectric insulating layers that are laminated together and may be populated with components
FEATURES:
Reduce Packaging Size& Increase Reliability
Repeatable process eliminates wiring labor, assembly errors
Minimize weight & Maximize component Areas
Streamline Mechanical & Electrical Design.
Increase Flexibility in performance & packaging
Operation temperature : -45 to 200
Layer count :1 to 16
Vibration resistant and chemistry resistant
Signal shielding is available
Various surface treatment is available
