Solution
- Conceptual Design (2D, 3D, etc.)
- Feasibility Analysis
- Design Verification (tolerance analysis, D-FMEA, P-FMEA, APQP, PPAP, etc.)
- Product documentation (drawings, validation protocols, product specifications, user manuals, etc.)
- Process Development
- Product Optimization
- Product Testing and Validation
- Product Release Document
- FPC Circuit Layout Design
- Design software
◆ IPC‑2223 Flexible Printed Board Design Standard
◆ IPC‑4101 General Requirements for Copper‑Clad Laminate Used in Printed Circuit Boards
◆ IPC‑4202 Insulating Materials for Flexible Printed Boards
◆ IPC‑4203 Coated Insulating Films with Adhesive for Flexible Printed Boards
◆ IPC‑4204 Flexible Insulating Materials with Metal Foil Cladding for Flexible Printed Boards
◆ IPC–4552 Chemical Gold Standard
◆ IPC–4553 Silver Chemical Standard
◆ IPC–4554 Tin Plating Standard
◆ IPC‑6013 Qualification and Performance Specification for Flexible Printed Boards
◆ IPC-A-610 Acceptability of Electronic Assemblies
◆ IPC‑TM‑650 Manual of Test Methods for Printed Boards
◆ IPC‑9252 O/S Optical Board Test Standard
