Solution

  1. Conceptual Design (2D, 3D, etc.)
  2. Feasibility Analysis
  3. Design Verification (tolerance analysis, D-FMEA, P-FMEA, APQP, PPAP, etc.)
  4. Product documentation (drawings, validation protocols, product specifications, user manuals, etc.)
  5. Process Development
  6. Product Optimization
  7. Product Testing and Validation
  8. Product Release Document
  9. FPC Circuit Layout Design
  10. Design software

◆ IPC‑2223 Flexible Printed Board Design Standard
◆ IPC‑4101 General Requirements for Copper‑Clad Laminate Used in Printed Circuit Boards
◆ IPC‑4202 Insulating Materials for Flexible Printed Boards
◆ IPC‑4203 Coated Insulating Films with Adhesive for Flexible Printed Boards
◆ IPC‑4204 Flexible Insulating Materials with Metal Foil Cladding for Flexible Printed Boards
◆ IPC–4552 Chemical Gold Standard
◆ IPC–4553 Silver Chemical Standard
◆ IPC–4554 Tin Plating Standard
◆ IPC‑6013 Qualification and Performance Specification for Flexible Printed Boards
◆ IPC-A-610 Acceptability of Electronic Assemblies
◆ IPC‑TM‑650 Manual of Test Methods for Printed Boards
◆ IPC‑9252 O/S Optical Board Test Standard