Solution

Heated soft board

Thick-Copper Etched FPC

Rigid-flex circuit board

Multilayer flexible printed circuit board

Double-sided board

Single-sided board (including hollowed-out single-sided)

SMT equipment capability

Connector Type

SMT Process Flow

Stacked CCS Technical Specifications

CCS Thermoforming Tray Specification Sheet

Plastic CCS Integrated Busbar

FDC Flexible Circuit (Aluminum/Copper Foil Flex Cable)

Thick-Copper Etched FPC

Rigid-Flex PCB Production Capacity Table

FPC Production Capacity Table

Aluminum-based FPCA

Mica CCS

Cold Pressed CCS

CBF CCS (with FDC, FPC)

Blister-type CCS, including FFC and FPC

Engineering Services

Engineering design capability

Car

New Energy Batteries – CCS Solution

Industry

Server

Aerospace

Medical care

Robotics

Robot

Equipment Project Unit Ability
Pick-and-place machine Machining dimensions mm Maximum: 2000*360
Minimum: 50*50
Processed plate thickness mm 0.1~10.0, maximum 50
Install the component mm 0201 package
Device Type - DIP, SMD, BGA, etc.
Repeatability mm ±0.05
  Positional accuracy mm ±0.05
Printing press Machining dimensions mm Maximum: 2000*360
Minimum: 50*50
Processed plate thickness mm 0.5~6.0
Repeatability mm ±0.013
Positional accuracy mm ±0.025
  Printed solder paste volume control % ±40
Reflow soldering Machining dimensions mm Maximum: 450
Minimum: 50
Processed plate thickness mm 0.5~6.0
Temperature tolerance °C ±1℃
SPI Machining dimensions mm Maximum: 2000*460
Minimum: 50*50
Processed plate thickness mm 0.5~6.0
Minimum inspection pad mm 0.1*0.15
3D AOI Machining dimensions mm Maximum: 2000*470
Minimum: 50*50
Processed plate thickness mm 0.5~6.0
Minimum inspection device mm 0.1*0.15
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