Solution

Thick‑copper‑etched FPCs fabricate circuit traces using thick copper (150 µm–1 mm, 6–40 mil), which undergo multiple etching and patterning steps, followed by the lamination of insulating cover films on both sides to create a three‑dimensional, molded copper structure.

250 µm copper thickness

500-micron copper thickness

330 µm copper thickness

250 µm copper thickness

215-micron copper thickness

152-micron copper thickness